Intel's foundry business has won 18A and 14A node design orders from AMD, NVIDIA and OpenAI. Intel's foundry business has made significant progress recently. According to reports from market analysis institutions KeyBanc Capital Markets and FactSet, Intel has successfully won orders from AMD, NVIDIA, OpenAI, Microsoft, US

Intel foundry business wins 18A and 14A node design orders from AMD, NVIDIA and OpenAI Intel's foundry business has made significant progress recently. According to reports from market analysts KeyBanc Capital Markets and FactSet, Intel has successfully won orders from a number of technology giants including AMD, NVIDIA, OpenAI, Microsoft, Micron and Marvell. These customers will use Intel's 18A and 14A advanced process technologies for chip design. As the demand in the semiconductor industry continues to grow, TSMC, the leading foundry, is currently unable to fully meet the production capacity needs of all customers, which provides Intel Foundry with an opportunity to enter the market. In terms of process nodes, Intel's 18A process has now entered the mass production ramp-up stage, with the yield rate increasing from 65% in the previous quarter to 85%. It is rapidly narrowing the gap with the 90% yield rate of TSMC's N2 process, and is already ahead of the 50% to 60% yield level of Samsung's SF2 process. In addition, Intel is also actively deploying the more advanced 14A process, which is expected to enter the risk production stage in 2028 and achieve large-scale mass production in 2029. In addition to advanced manufacturing processes, Intel's packaging technology is also experiencing breakthroughs. Its core Embedded Multi-chip Interconnect Bridge (EMIB) technology has performed well. It is said that the yield rate of EMIB-T technology has reached the high industry standard of 98%, which is significantly improved compared to the 90% reported three months ago. This achievement is regarded as a key node for Intel to benchmark TSMC's CoWoS technology in the packaging field, and can effectively alleviate the pain point of the current shortage of advanced packaging production capacity in the industry. In the future, Intel also plans to use its facility in Rio Rancho, New Mexico, to further advance glass substrate packaging technology to enable larger-scale chip interconnects. This series of technical layout and market expansion have achieved initial results. Intel is currently using the 18A process to mass-produce Panther Lake and Wildcat Lake series products, and plans to further expand the production capacity of Intel 4 and Intel 3 to cope with the surge in demand driven by AI in the data center field. The analysis pointed out that with the steady advancement of the 18A process, highly competitive pricing strategies and strong packaging technology support, Intel's foundry business is entering a rapid growth track and is expected to continue to gain favor from leading customers including Apple and Meta, thus laying a solid foundation for the company to achieve its long-term growth goals until 2030. via cnBeta.COM - Chinese industry information station (author: source: cnBeta.COM)