It is rumored that Anthropic plans to build a 2nm AI chip with Samsung and Broadcom. The key specifications have not yet been confirmed. Anthropic is advancing a customized AI accelerator project. It is planned that Broadcom will be responsible for the chip design and then handed over to Samsung's foundry department for production using the SF2 2nm process.

It is rumored that Anthropic plans to build a 2nm AI chip with Samsung and Broadcom. The key specifications have not yet been confirmed. Anthropic is promoting a customized AI accelerator project. It is planned that Broadcom will be responsible for the chip design and then be handed over to Samsung's foundry department for production using the SF2 2nm process. The rumored first batch of production is about 200,000 units, and the scale is relatively limited; the project still requires supporting networks, cabinets, power supplies, and cooling systems. Anthropic will reportedly first evaluate the feasibility of the entire infrastructure. Anthropic, Samsung and Broadcom have not publicly confirmed this foundry arrangement or related figures. The rumored specifications of this batch of chips include an INT8 computing power of approximately 4,000 TOPS, a thermal design power consumption of approximately 1,300 watts per chip, and 192GB HBM3E high-bandwidth memory; if design conditions permit, the memory capacity may be increased to 288GB. The packaging solution has not yet been finalized. TechPowerUp speculates that Samsung may use its own I-Cube 2.5D packaging technology. The above performance, power consumption, memory and production figures are unconfirmed and cannot be regarded as final product specifications. Anthropic has previously confirmed through a company spokesperson that it is forming an internal chip team to design customized chips for Claude, and said it will work with partners to design hardware and models to improve operating efficiency; the company also emphasized that the multi-chip strategy will remain an important way to expand computing power. Anthropic publicly stated that its infrastructure will continue to use AWS Trainium, Google TPU and NVIDIA GPU, and has announced expanded cooperation with Google and Broadcom to obtain multi-gigawatt TPU computing power that will be launched starting in 2027. Therefore, even if the custom chip project is true, it does not mean that Anthropic will immediately get rid of the existing cloud and chip suppliers. Samsung's official information shows that SF2 is its 2-nanometer process node and has launched mass production in 2025; Samsung has also announced a cooperation case using 2-nanometer GAA process and I-Cube packaging to develop AI accelerators for Japan's Preferred Networks. However, this information can only prove that Samsung has relevant process and packaging capabilities, but cannot prove that the Anthropic project has been signed. The cooperation memorandum announced by Samsung and Broadcom this year involves memory, advanced process and packaging technology, but does not mention Anthropic or this chip; reports in July stated that Anthropic was still in the early evaluation stage at the time and had not yet finalized the design or started manufacturing. via cnBeta.COM - Chinese industry information station (auth